On Sat, 20 Dec 2003 12:34:38 -0500
Tom <lurch@vt.edu> wrote:
> On Saturday 20 December 2003 11:07 am, you wrote:
> > Tom,
> >
> > congrats on your buy :)
> >
> > I very much doubt that you will get the device apart without
> > breaking the seal and voiding your warranty.
> > (It's probably hidden somewhere in the battery compartment)
>
> Oh well, before I bought it I knew that I'd probably void the warranty...
>
> So now that I have the back off, what am I looking for? I posted pictures
> here:
> http://filebox.vt.edu/users/tpanning/
> (watch out, they're about 1.25MB each). The detail is fine enough that
> you can read the labels on the chips.
>
> By the way, would anything interesting be under the front cover?
You need to look for information that can lead to driver development,
eg. in the h2200 there was:
- a Zeevo bluetooth module (TC2001?)
- a MediaQ graphics driver (MQ1178)
- the CPU (of course!) PXA255
- DRAM modules (2 of) (for 64MB that means 2 x 256Mbit chips)
- an ASIC (a companion chip for the CPU)
the h2200 has a Samsung HAMCOP, while the h55xx(?) has a SAMCOP.
other chips that you can identify are a bonus at this stage.
> There
> are two points that are much stiffer than the little "snaps" that are
> holding it together everywhere else. Oh, and there are wires going from
> the buttons on the cover to the body, so I'm not sure how far apart I'd
> be able to separate them anyways.
Please dont break anything! :)) Ask Dr Jamey first :)
He's very experienced and most helpful.
> Thanks,
> Tom
>
Marcus
Received on Sat Dec 20 18:47:52 2003
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